MC68030FE20C
vs
MC68EC030FE25C
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP,
|
LEAD FREE, CERAMIC, QFP-132
|
Pin Count |
132
|
132
|
Reach Compliance Code |
unknown
|
unknown
|
Address Bus Width |
32
|
32
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
NO
|
Clock Frequency-Max |
20 MHz
|
25 MHz
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
YES
|
JESD-30 Code |
S-CQFP-G132
|
S-CQFP-G132
|
Length |
22.355 mm
|
24.13 mm
|
Low Power Mode |
NO
|
NO
|
Moisture Sensitivity Level |
1
|
1
|
Number of Terminals |
132
|
132
|
Operating Temperature-Min |
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QFP
|
QFP
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
Seated Height-Max |
4.31 mm
|
3.175 mm
|
Speed |
20 MHz
|
25 MHz
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
HCMOS
|
Terminal Finish |
NOT SPECIFIED
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.635 mm
|
0.635 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Width |
22.355 mm
|
24.13 mm
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
Base Number Matches |
4
|
4
|
Pbfree Code |
|
Yes
|
Additional Feature |
|
DYNAMIC BUS SIZING;UPTO 9.2 MIPS
|
JESD-609 Code |
|
e3
|
Operating Temperature-Max |
|
70 °C
|
Temperature Grade |
|
COMMERCIAL
|
|
|
|