MC68030FE16C
vs
TS68020DESC04YA
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
THOMSON-CSF SEMICONDUCTORS
|
| Part Package Code |
QFN
|
QFP
|
| Package Description |
QCCJ,
|
,
|
| Pin Count |
132
|
132
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
DYNAMIC BUS SIZING;UPTO 9.2 MIPS
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
X-CQCC-J132
|
S-CQFP-G132
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
132
|
132
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
|
| Package Shape |
UNSPECIFIED
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| Clock Frequency-Max |
|
25 MHz
|
| Speed |
|
25 MHz
|
|
|
|
Compare MC68030FE16C with alternatives
Compare TS68020DESC04YA with alternatives