MC68030FE16C vs NG80960KB-20 feature comparison

MC68030FE16C Motorola Mobility LLC

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NG80960KB-20 Intel Corporation

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC INTEL CORP
Part Package Code QFN QFP
Package Description QCCJ, QFP, SPQFP132,1.1SQ
Pin Count 132 132
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01
Additional Feature DYNAMIC BUS SIZING;UPTO 9.2 MIPS OPERATING CASE TEMPERATURE 0 TO 100 C
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan NO NO
External Data Bus Width 32 32
Format FIXED POINT FLOATING POINT
Integrated Cache YES NO
JESD-30 Code X-CQCC-J132 S-PQFP-G132
Low Power Mode YES NO
Number of Terminals 132 132
Operating Temperature-Max 70 °C 100 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code QCCJ QFP
Package Shape UNSPECIFIED SQUARE
Package Style CHIP CARRIER FLATPACK
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology HCMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Form J BEND GULL WING
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR, RISC
Base Number Matches 1 2
Rohs Code No
Clock Frequency-Max 40 MHz
JESD-609 Code e0
Length 24.13 mm
Number of DMA Channels
Number of External Interrupts 4
Number of Serial I/Os
On Chip Data RAM Width
Package Equivalence Code SPQFP132,1.1SQ
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies 5 V
RAM (words) 0
Seated Height-Max 4.57 mm
Speed 20 MHz
Supply Current-Max 360 mA
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Pitch 0.635 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 24.13 mm

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