MC68030FE16C
vs
MC68030FE16C
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
QFN
|
QFP
|
| Package Description |
QCCJ,
|
LEAD FREE, CERAMIC, QFP-132
|
| Pin Count |
132
|
132
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
DYNAMIC BUS SIZING;UPTO 9.2 MIPS
|
DYNAMIC BUS SIZING;UPTO 9.2 MIPS
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
X-CQCC-J132
|
S-CQFP-G132
|
| Low Power Mode |
YES
|
NO
|
| Number of Terminals |
132
|
132
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QCCJ
|
QFP
|
| Package Shape |
UNSPECIFIED
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
3A991
|
| Samacsys Manufacturer |
|
NXP
|
| Clock Frequency-Max |
|
16 MHz
|
| JESD-609 Code |
|
e3
|
| Length |
|
24.13 mm
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
3.175 mm
|
| Speed |
|
16 MHz
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
0.635 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
24.13 mm
|
|
|
|
Compare MC68030FE16C with alternatives
Compare MC68030FE16C with alternatives