MC68020RC33E
vs
TS68020VR25
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
THOMSON-CSF SEMICONDUCTORS
|
| Part Package Code |
PGA
|
PGA
|
| Package Description |
PGA,
|
CERAMIC, PGA-114
|
| Pin Count |
114
|
114
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
33 MHz
|
25 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-CPGA-P114
|
S-CPGA-P114
|
| JESD-609 Code |
e0
|
|
| Length |
34.545 mm
|
|
| Low Power Mode |
NO
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
7
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
114
|
114
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
PGA
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
3.81 mm
|
|
| Speed |
33 MHz
|
25 MHz
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
HCMOS
|
HCMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
PERPENDICULAR
|
PERPENDICULAR
|
| Width |
34.545 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MC68020RC33E with alternatives
Compare TS68020VR25 with alternatives