MC68020RC33E
vs
TS68020MR25
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
THOMSON-CSF SEMICONDUCTORS
Part Package Code
PGA
PGA
Package Description
PGA,
CERAMIC, PGA-114
Pin Count
114
114
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.A.2
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
33 MHz
25 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CPGA-P114
S-CPGA-P114
JESD-609 Code
e0
Length
34.545 mm
Low Power Mode
NO
YES
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
Number of Terminals
114
114
On Chip Data RAM Width
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
3.81 mm
Speed
33 MHz
25 MHz
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
HCMOS
HCMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
34.545 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
1
Category CO2 Kg
12.2
Compliance Temperature Grade
Military: -55C to +125C
Compare MC68020RC33E with alternatives
Compare TS68020MR25 with alternatives