MC68020FE25E
vs
TS68020MFB/C16
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOTOROLA INC
ATMEL CORP
Package Description
CERAMIC, QFP-132
QFP, QFP132,1.2SQ
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
25 MHz
16.67 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CQFP-G132
S-CQFP-G132
JESD-609 Code
e0
e0
Length
22.355 mm
24.13 mm
Low Power Mode
NO
NO
Moisture Sensitivity Level
1
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
Number of Terminals
132
132
On Chip Data RAM Width
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
QFP
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.318 mm
Speed
25 MHz
16.67 MHz
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
HCMOS
HCMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
QUAD
QUAD
Width
22.355 mm
24.13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
4
5
Part Package Code
QFP
Pin Count
132
ECCN Code
3A001.A.2.C
Package Equivalence Code
QFP132,1.2SQ
Screening Level
MIL-STD-883 Class B
Supply Current-Max
333 mA
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