MC68020FE25
vs
MC68EC030FE25CB1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
MOTOROLA INC
Package Description
QFP, QFP132,1.2SQ
CERAMIC, QFP-132
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Additional Feature
DYNAMIC BUS SIZING; 3 PIPELINE STAGES
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
25 MHz
25 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-CQFP-G132
S-CQFP-G132
JESD-609 Code
e0
Length
22.355 mm
24.13 mm
Low Power Mode
NO
YES
Number of DMA Channels
Number of External Interrupts
8
Number of Serial I/Os
Number of Terminals
132
132
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFP
QFP
Package Equivalence Code
QFP132,1.2SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
4.31 mm
3.175 mm
Speed
25 MHz
25 MHz
Supply Voltage-Max
5.25 V
5.25 V
Supply Voltage-Min
4.75 V
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
HCMOS
HCMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.635 mm
Terminal Position
QUAD
QUAD
Width
22.355 mm
24.13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
4
3
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