MC68010RC8
vs
MC68000RC8
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
PGA, PGA68,10X10
PGA, PGA68,10X10
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
Address Bus Width
24
Bit Size
32
32
Boundary Scan
NO
Clock Frequency-Max
8 MHz
External Data Bus Width
16
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-CPGA-P68
S-XPGA-P68
JESD-609 Code
e0
e0
Length
26.92 mm
Low Power Mode
NO
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
Number of Terminals
68
68
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
PGA
PGA
Package Equivalence Code
PGA68,10X10
PGA68,10X10
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
5.16 mm
Speed
8 MHz
8 MHz
Supply Current-Max
25 mA
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
MOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
26.92 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
3
3
Power Supplies
5 V
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