MC68010L12X
vs
TS68C000MC12A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
ATMEL CORP
Package Description
DIP,
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
24
24
Bit Size
16
32
Boundary Scan
NO
NO
Clock Frequency-Max
12.5 MHz
12.5 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-CDIP-T64
R-CDIP-T64
Low Power Mode
YES
NO
Number of DMA Channels
Number of External Interrupts
3
Number of Serial I/Os
Number of Terminals
64
64
On Chip Data RAM Width
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Speed
12.5 MHz
12.5 MHz
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
HCMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
2
2
Part Package Code
DIP
Pin Count
64
ECCN Code
3A001.A.2.C
Length
81.28 mm
Seated Height-Max
4.83 mm
Terminal Pitch
2.54 mm
Width
22.86 mm
Compare MC68010L12X with alternatives
Compare TS68C000MC12A with alternatives