MC68010L12X
vs
MC68HC000L8
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP,
DIP, DIP64,.9
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
Address Bus Width
24
Bit Size
16
32
Boundary Scan
NO
Clock Frequency-Max
12.5 MHz
External Data Bus Width
16
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
R-CDIP-T64
R-XDIP-T64
Low Power Mode
YES
Number of DMA Channels
Number of External Interrupts
3
Number of Serial I/Os
Number of Terminals
64
64
On Chip Data RAM Width
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Speed
12.5 MHz
8 MHz
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP64,.9
Power Supplies
5 V
Supply Current-Max
25 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Pitch
2.54 mm
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