MC68010IR16
vs
TSX68C000MC10A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
E2V TECHNOLOGIES PLC
Package Description
DIP,
DIP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
23
24
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
16.67 MHz
10 MHz
External Data Bus Width
16
16
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
R-PDIP-T64
R-CDIP-T64
Length
81.535 mm
81.28 mm
Low Power Mode
NO
NO
Number of DMA Channels
Number of External Interrupts
7
Number of Serial I/Os
Number of Terminals
64
64
On Chip Data RAM Width
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
RAM (words)
0
Seated Height-Max
5.84 mm
4.83 mm
Speed
16.67 MHz
10 MHz
Supply Current-Max
50 mA
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
HCMOS
Temperature Grade
OTHER
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
22.86 mm
22.86 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
1
1
Part Package Code
DIP
Pin Count
64
ECCN Code
3A001.A.2.C
Compare MC68010IR16 with alternatives
Compare TSX68C000MC10A with alternatives