MC68008L10D
vs
Z8003BB6
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
STMICROELECTRONICS
|
| Package Description |
DIP, DIP48,.6
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| Bit Size |
32
|
16
|
| JESD-30 Code |
R-XDIP-T48
|
R-PDIP-T48
|
| JESD-609 Code |
e0
|
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP48,.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supplies |
5 V
|
|
| Speed |
10 MHz
|
10 MHz
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
MOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
3
|
1
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
48
|
| HTS Code |
|
8542.31.00.01
|
| Address Bus Width |
|
16
|
| Boundary Scan |
|
NO
|
| Clock Frequency-Max |
|
10 MHz
|
| External Data Bus Width |
|
16
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
NO
|
| Low Power Mode |
|
NO
|
| Qualification Status |
|
Not Qualified
|
| Supply Voltage-Max |
|
5.25 V
|
| Supply Voltage-Min |
|
4.75 V
|
| Width |
|
15.24 mm
|
|
|
|
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