MC68008CL8 vs Z8003BB6 feature comparison

MC68008CL8 Motorola Mobility LLC

Buy Now Datasheet

Z8003BB6 STMicroelectronics

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 48 48
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 20 16
Bit Size 16 16
Boundary Scan NO NO
Clock Frequency-Max 8 MHz 10 MHz
External Data Bus Width 8 16
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-CDIP-T48 R-PDIP-T48
Length 60.96 mm
Low Power Mode YES NO
Number of DMA Channels
Number of External Interrupts 3
Number of Serial I/Os
Number of Terminals 48 48
On Chip Data RAM Width
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
RAM (words) 0
Seated Height-Max 4.31 mm
Speed 8 MHz 10 MHz
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 1 1

Compare MC68008CL8 with alternatives

Compare Z8003BB6 with alternatives