Findchips: Compare MC68000ILC12F vs MC68000CLC16

MC68000ILC12F vs MC68000CLC16 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	MOTOROLA INC	MOTOROLA INC
Part Package Code	DIP	DIP
Package Description	DIP,	DIP,
Pin Count	64	64
Reach Compliance Code	unknown	unknown
HTS Code	8542.31.00.01	8542.31.00.01
Address Bus Width	23	23
Bit Size	32	32
Boundary Scan	NO	NO
Clock Frequency-Max	16.67 MHz	16.67 MHz
External Data Bus Width	16	16
Format	FIXED POINT	FIXED POINT
Integrated Cache	NO	NO
JESD-30 Code	R-CDIP-T64	R-CDIP-T64
Length	81.28 mm	81.28 mm
Low Power Mode	NO	NO
Number of DMA Channels
Number of External Interrupts	7	7
Number of Serial I/Os
Number of Terminals	64	64
On Chip Data RAM Width
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min		-40 °C
Package Body Material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package Code	DIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE	IN-LINE
Qualification Status	Not Qualified	Not Qualified
RAM (words)	0	0
Seated Height-Max	4.32 mm	4.32 mm
Speed	16.67 MHz	16.67 MHz
Supply Current-Max	50 mA	50 mA
Supply Voltage-Max	5.25 V	5.25 V
Supply Voltage-Min	4.75 V	4.75 V
Supply Voltage-Nom	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	OTHER	INDUSTRIAL
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Width	22.86 mm	22.86 mm
uPs/uCs/Peripheral ICs Type	MICROPROCESSOR	MICROPROCESSOR
Base Number Matches	2	2
	Microcontrollers and Processors » Microprocessors	Microcontrollers and Processors » Microprocessors