MC68000FN10
vs
UPD70216HLP-16
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NEC ELECTRONICS AMERICA INC
|
| Part Package Code |
LCC
|
|
| Package Description |
QCCJ, LDCC68,1.0SQ
|
0.950 X 0.950 INCH, PLASTIC, QFJ-68
|
| Pin Count |
68
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Address Bus Width |
23
|
20
|
| Bit Size |
32
|
16
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
10 MHz
|
32 MHz
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
NO
|
NO
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQCC-J68
|
| JESD-609 Code |
e0
|
|
| Low Power Mode |
NO
|
YES
|
| Number of DMA Channels |
|
4
|
| Number of External Interrupts |
7
|
8
|
| Number of Serial I/Os |
|
1
|
| Number of Terminals |
68
|
68
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
0
|
| Speed |
10 MHz
|
16 MHz
|
| Supply Current-Max |
30 mA
|
144 mA
|
| Supply Voltage-Max |
5.25 V
|
5.5 V
|
| Supply Voltage-Min |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
MOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR
|
| Base Number Matches |
3
|
1
|
| Length |
|
24.2 mm
|
| Seated Height-Max |
|
4.6 mm
|
| Width |
|
24.2 mm
|
|
|
|
Compare MC68000FN10 with alternatives
Compare UPD70216HLP-16 with alternatives