MC54HCT574AJ
vs
TC74HCT574AP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
TOSHIBA CORP
Package Description
DIP, DIP20,.3
DIP, DIP20,.3
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-XDIP-T20
R-PDIP-T20
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
150 pF
Logic IC Type
D FLIP-FLOP
BUS DRIVER
Max Frequency@Nom-Sup
20000000 Hz
25000000 Hz
Max I(ol)
0.006 A
0.006 A
Number of Functions
8
1
Number of Terminals
20
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
4
1
Pbfree Code
Part Package Code
DIP
Pin Count
20
Family
HCT
Length
24.6 mm
Number of Bits
8
Number of Ports
2
Output Polarity
TRUE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
48 ns
Seated Height-Max
4.45 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
7.62 mm
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