MC54HCT541JD vs TC74HCT541AP feature comparison

MC54HCT541JD Motorola Mobility LLC

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TC74HCT541AP Toshiba America Electronic Components

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, DIP, DIP20,.3
Pin Count 20 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DUAL OUTPUT ENABLE
Family HCT HCT
JESD-30 Code R-CDIP-T20 R-PDIP-T20
JESD-609 Code e0
Length 24.515 mm 24.6 mm
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP20,.3 DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 45 ns 36 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 3 1
Samacsys Manufacturer Toshiba
Control Type ENABLE LOW
Max I(ol) 0.006 A
Packing Method TUBE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 29 ns
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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