MC54HC251JD
vs
MM74HC251N
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
NATIONAL SEMICONDUCTOR CORP
|
| Package Description |
DIP, DIP16,.3
|
DIP-16
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
R-XDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Max I(ol) |
0.004 A
|
0.004 A
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
8
|
8
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supplies |
2/6 V
|
|
| Prop. Delay@Nom-Sup |
66 ns
|
49 ns
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
4
|
| Additional Feature |
|
ENABLE TIME @ RL=1K OHM
|
| Family |
|
HC/UH
|
| Length |
|
19.305 mm
|
| Number of Outputs |
|
1
|
| Output Polarity |
|
COMPLEMENTARY
|
| Propagation Delay (tpd) |
|
256 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
6 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
4.5 V
|
| Width |
|
7.62 mm
|
|
|
|