MC54HC175J
vs
74HC175N
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
PHILIPS SEMICONDUCTORS
|
Package Description |
DIP, DIP16,.3
|
DIP-16
|
Reach Compliance Code |
unknown
|
unknown
|
JESD-30 Code |
R-XDIP-T16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
e4
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
20000000 Hz
|
24000000 Hz
|
Max I(ol) |
0.004 A
|
0.004 A
|
Number of Functions |
4
|
4
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
CERAMIC
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Power Supplies |
2/6 V
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Base Number Matches |
4
|
2
|
HTS Code |
|
8542.39.00.01
|
|
|
|