MC54HC175AJ vs M74HCT273RM13TR feature comparison

MC54HC175AJ Motorola Mobility LLC

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M74HCT273RM13TR STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC STMICROELECTRONICS
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP20,.4
Pin Count 16 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HCT
JESD-30 Code R-GDIP-T16 R-PDSO-G20
Length 19.495 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 4 8
Number of Functions 1 1
Number of Terminals 16 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 32 ns 45 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.65 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.5 mm
fmax-Min 25 MHz 20 MHz
Base Number Matches 2 1
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 3
Package Equivalence Code SOP20,.4
Packing Method TR
Peak Reflow Temperature (Cel) 260
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

Compare MC54HC175AJ with alternatives

Compare M74HCT273RM13TR with alternatives