MC54HC163J
vs
CD54HC163F3A
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
HARRIS SEMICONDUCTOR
Package Description
DIP, DIP16,.3
DIP-16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TCO OUTPUT
TCO OUTPUT
Count Direction
UP
UP
Family
HC/UH
HC/UH
JESD-30 Code
R-GDIP-T16
R-GDIP-T16
JESD-609 Code
e0
e0
Length
19.3 mm
Load Capacitance (CL)
50 pF
50 pF
Load/Preset Input
YES
YES
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Max Frequency@Nom-Sup
62000000 Hz
20000000 Hz
Max I(ol)
0.004 A
0.004 A
Mode of Operation
SYNCHRONOUS
SYNCHRONOUS
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
62 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.19 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
fmax-Min
20 MHz
Base Number Matches
3
4
Screening Level
38535Q/M;38534H;883B
Compare MC54HC163J with alternatives
Compare CD54HC163F3A with alternatives