MC54HC157AJD vs CD54HC251H/3A feature comparison

MC54HC157AJD Freescale Semiconductor

Buy Now Datasheet

CD54HC251H/3A Intersil Corporation

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS HARRIS SEMICONDUCTOR
Package Description DIP, DIP16,.3 DIE,
Reach Compliance Code unknown unknown
JESD-30 Code R-XDIP-T16 X-XUUC-N16
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.004 A
Number of Functions 4 1
Number of Inputs 2 8
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP16,.3 DIE OR CHIP
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Power Supplies 2/6 V
Prop. Delay@Nom-Sup 33 ns
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Base Number Matches 3 2
HTS Code 8542.39.00.01
Family HC/UH
Number of Outputs 1
Output Characteristics 3-STATE
Output Polarity COMPLEMENTARY
Propagation Delay (tpd) 370 ns
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V

Compare CD54HC251H/3A with alternatives