MC54HC157AJ
vs
MM54HC157J-MIL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
kg CO2e/kg
12.6
12.6
Average Weight (mg)
1187.4
1187.4
CO2e (mg)
14961.241
14961.241
Category CO2 Kg
12.6
12.6
Compliance Temperature Grade
Military: -55C to +125C
Military: -55C to +125C
Conflict Mineral Status
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
Conflict Minerals Statement
Family
HC/UH
JESD-30 Code
R-GDIP-T16
R-XDIP-T16
JESD-609 Code
e0
e0
Length
19.495 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
33 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
4
2
Candidate List Date
2011-06-20
Package Equivalence Code
DIP16,.3
Screening Level
MIL-STD-883 Class B (Modified)
Compare MC54HC157AJ with alternatives
Compare MM54HC157J-MIL with alternatives