MC54F74JD vs N74F5074N feature comparison

MC54F74JD Freescale Semiconductor

Buy Now Datasheet

N74F5074N YAGEO Corporation

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS PHILIPS COMPONENTS
Package Description DIP, DIP14,.3 ,
Reach Compliance Code unknown unknown
JESD-30 Code R-XDIP-T14 R-PDIP-T14
JESD-609 Code e0
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Base Number Matches 3 3
HTS Code 8542.39.00.01
Additional Feature WITH METASTABLE IMMUNE CHARACTERISTICS
Family F/FAST
Load Capacitance (CL) 50 pF
Number of Bits 1
Output Polarity COMPLEMENTARY
Power Supply Current-Max (ICC) 24 mA
Propagation Delay (tpd) 6 ns
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
fmax-Min 150 MHz

Compare N74F5074N with alternatives