MC54F537JD
vs
N74F537N
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP,
|
0.300 INCH, PLASTIC, DIP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
2 ENABLE INPUTS
|
2 ENABLE INPUTS
|
| Family |
F/FAST
|
F/FAST
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-CDIP-T20
|
R-PDIP-T20
|
| Length |
24.515 mm
|
26.695 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
DECIMAL DECODER/DRIVER
|
DECIMAL DECODER/DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
CONFIGURABLE
|
CONFIGURABLE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
15 ns
|
12 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
4.06 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| Max I(ol) |
|
0.024 A
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
DIP20,.3
|
| Power Supply Current-Max (ICC) |
|
66 mA
|
| Prop. Delay@Nom-Sup |
|
17 ns
|
|
|
|
Compare MC54F537JD with alternatives
Compare N74F537N with alternatives