MC54F533JD
vs
54F533DMQB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
E2V TECHNOLOGIES PLC
|
| Package Description |
DIP, DIP20,.3
|
,
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
R-XDIP-T20
|
R-GDIP-T20
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
D LATCH
|
BUS DRIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP20,.3
|
DIP20,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN LINE
|
| Power Supplies |
5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
MILITARY
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Additional Feature |
|
LG_MAX
|
| Control Type |
|
ENABLE LOW
|
| Count Direction |
|
UNIDIRECTIONAL
|
| Family |
|
F/FAST
|
| Length |
|
25.019 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.02 A
|
| Number of Ports |
|
2
|
| Output Polarity |
|
INVERTED
|
| Power Supply Current-Max (ICC) |
|
61 mA
|
| Prop. Delay@Nom-Sup |
|
14 ns
|
| Propagation Delay (tpd) |
|
14 ns
|
| Screening Level |
|
MIL-STD-883 Class B
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Width |
|
7.62 mm
|
|
|
|