MC54F378JD
vs
MC74F378J
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA INC
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-XDIP-T16
R-GDIP-T16
JESD-609 Code
e0
e0
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Functions
6
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
3
3
Part Package Code
DIP
Pin Count
16
HTS Code
8542.39.00.01
Additional Feature
WITH HOLD MODE
Family
F/FAST
Length
19.495 mm
Number of Bits
6
Output Polarity
TRUE
Propagation Delay (tpd)
9.5 ns
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Width
7.62 mm
fmax-Min
140 MHz
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