MC54F378JD
vs
54F378/B2AJC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP, DIP16,.3
QCCN, LCC20,.35SQ
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
WITH HOLD MODE
Family
F/FAST
JESD-30 Code
R-GDIP-T16
S-XQCC-N20
JESD-609 Code
e0
e0
Length
19.3 mm
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
6
Number of Functions
1
6
Number of Terminals
16
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
QCCN
Package Equivalence Code
DIP16,.3
LCC20,.35SQ
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
CHIP CARRIER
Power Supply Current-Max (ICC)
45 mA
45 mA
Propagation Delay (tpd)
10.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.19 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
QUAD
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
7.62 mm
fmax-Min
80 MHz
Base Number Matches
3
3
Max Frequency@Nom-Sup
80000000 Hz
Max I(ol)
0.02 A
Power Supplies
5 V
Screening Level
38535Q/M;38534H;883B
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