MC54F374JS
vs
MC74F374N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP, DIP20,.3
DIP, DIP20,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
JESD-30 Code
R-XDIP-T20
R-PDIP-T20
JESD-609 Code
e0
e0
Logic IC Type
BUS DRIVER
D FLIP-FLOP
Number of Functions
8
8
Number of Terminals
20
20
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP20,.3
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Base Number Matches
3
3
Max Frequency@Nom-Sup
70000000 Hz
Max I(ol)
0.024 A
Power Supplies
5 V
Power Supply Current-Max (ICC)
86 mA