MC54F259JD vs N74F259N,602 feature comparison

MC54F259JD Motorola Mobility LLC

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N74F259N,602 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 1:8 DMUX FOLLOWED BY LATCH 1:8 DMUX FOLLOWED BY LATCH; RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
Family F/FAST F/FAST
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Length 19.3 mm 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D LATCH D LATCH
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 10.2 mA 75 mA
Propagation Delay (tpd) 8.5 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.19 mm 4.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type LOW LEVEL LOW LEVEL
Width 7.62 mm 7.62 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT38-4
JESD-609 Code e4
Max I(ol) 0.02 A
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 14.5 ns
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MC54F259JD with alternatives

Compare N74F259N,602 with alternatives