MC54F182J vs N74F182N feature comparison

MC54F182J Motorola Mobility LLC

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N74F182N Philips Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC PHILIPS SEMICONDUCTORS
Part Package Code DIP
Package Description DIP, DIP16,.3 DIP-16
Pin Count 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH HIGHER ORDER LOOKAHEAD
Family F/FAST
JESD-30 Code R-GDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Length 19.3 mm
Load Capacitance (CL) 50 pF
Logic IC Type LOOK-AHEAD CARRY GENERATOR LOOK-AHEAD CARRY GENERATOR
Number of Bits 4
Number of Functions 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supply Current-Max (ICC) 36 mA
Propagation Delay (tpd) 11 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.19 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm
Base Number Matches 3 3

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