MC54F153JD
vs
54F153/BEA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
PHILIPS SEMICONDUCTORS
Package Description
DIP,
DIP-16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
F/FAST
JESD-30 Code
R-GDIP-T16
R-XDIP-T16
Length
19.3 mm
Load Capacitance (CL)
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
2
2
Number of Inputs
4
4
Number of Outputs
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Polarity
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
20 mA
20 mA
Propagation Delay (tpd)
11 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.19 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
2
3
Rohs Code
JESD-609 Code
e0
Max I(ol)
0.02 A
Package Equivalence Code
DIP16,.3
Prop. Delay@Nom-Sup
8 ns
Screening Level
38535Q/M;38534H;883B
Terminal Finish
Tin/Lead (Sn/Pb)
Compare MC54F153JD with alternatives