MC44BC374DTBR2 vs MC44BC374T1D feature comparison

MC44BC374DTBR2 Freescale Semiconductor

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MC44BC374T1D NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code TSSOP
Package Description TSSOP, TSSOP24,.25 SOP-16
Pin Count 24
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.39.00.01
Consumer IC Type CONSUMER CIRCUIT CONSUMER CIRCUIT
JESD-30 Code R-PDSO-G24 R-PDSO-G16
JESD-609 Code e0
Length 7.8 mm 9.9 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 24 16
Operating Temperature-Max 80 °C 85 °C
Operating Temperature-Min -10 °C -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP24,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 220
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1.75 mm
Supply Current-Max 88 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Surface Mount YES YES
Technology BICMOS BICMOS
Temperature Grade COMMERCIAL EXTENDED OTHER
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 3.9 mm
Base Number Matches 4 5
Factory Lead Time 4 Weeks

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