MC4016L
vs
HEF4516BDB
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
DIP,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
PROGRAMMABLE TO DIVIDE INPUT BY 0 - 9
|
TCO OUTPUT
|
| Count Direction |
DOWN
|
BIDIRECTIONAL
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-GDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
|
| Length |
19.3 mm
|
|
| Load Capacitance (CL) |
15 pF
|
50 pF
|
| Load/Preset Input |
YES
|
YES
|
| Logic IC Type |
DIVIDE BY N COUNTER
|
BINARY COUNTER
|
| Mode of Operation |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Number of Bits |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
65 mA
|
|
| Propagation Delay (tpd) |
45 ns
|
290 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.19 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
7.62 mm
|
| fmax-Min |
8 MHz
|
3 MHz
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare MC4016L with alternatives
Compare HEF4516BDB with alternatives