MC35001BU vs MC35001BU feature comparison

MC35001BU Freescale Semiconductor

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MC35001BU Motorola Semiconductor Products

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS MOTOROLA INC
Package Description DIP, DIP8,.3 DIP, DIP8,.3
Reach Compliance Code unknown unknown
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.0002 µA 0.0002 µA
Common-mode Reject Ratio-Min 80 dB 80 dB
Common-mode Reject Ratio-Nom 100 dB 100 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 7000 µV 5000 µV
JESD-30 Code R-XDIP-T8 R-GDIP-T8
JESD-609 Code e0 e0
Length 10.415 mm 10.415 mm
Low-Bias YES YES
Low-Offset NO NO
Neg Supply Voltage Limit-Max -22 V -22 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP8,.3 DIP8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supplies +-15 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Slew Rate-Nom 13 V/us 13 V/us
Supply Current-Max 2.5 mA 2.5 mA
Supply Voltage Limit-Max 22 V 22 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology JFET JFET
Temperature Grade MILITARY MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Unity Gain BW-Nom 4000 4000
Voltage Gain-Min 50000 50000
Width 7.62 mm 7.62 mm
Base Number Matches 4 4
ECCN Code EAR99
HTS Code 8542.33.00.01

Compare MC35001BU with alternatives

Compare MC35001BU with alternatives