MC33887DWBR2 vs MC33887DWB feature comparison

MC33887DWBR2 Motorola Mobility LLC

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MC33887DWB Freescale Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code SOIC SOIC
Package Description HSSOP, 4.60 X 4.60 MM, 0.65 MM PITCH, PLASTIC, SOIC-54
Pin Count 54 54
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type STEPPER MOTOR CONTROLLER STEPPER MOTOR CONTROLLER
JESD-30 Code R-PDSO-G54 R-PDSO-G54
Length 17.9 mm 17.9 mm
Number of Functions 1 1
Number of Terminals 54 54
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HSSOP HSSOP
Package Equivalence Code SSOP54,.4 SSOP54,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 240
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.45 mm
Supply Voltage-Max (Vsup) 28 V 28 V
Supply Voltage-Min (Vsup) 5 V 5 V
Supply Voltage-Nom (Vsup) 14 V 14 V
Surface Mount YES YES
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 7.5 mm 7.5 mm
Base Number Matches 1 3
Rohs Code No
JESD-609 Code e0
Moisture Sensitivity Level 3
Terminal Finish TIN LEAD

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