MC33794DWB vs MC33794DWBR2 feature comparison

MC33794DWB Motorola Mobility LLC

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MC33794DWBR2 Freescale Semiconductor

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer MOTOROLA INC FREESCALE SEMICONDUCTOR INC
Part Package Code SOIC SOIC
Package Description HSSOP, SSOP54,.4 SOICW-54
Pin Count 54 54
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.31.00.01
Analog IC - Other Type ANALOG CIRCUIT ANALOG CIRCUIT
JESD-30 Code R-PDSO-G54 R-PDSO-G54
Length 17.9 mm 17.9 mm
Number of Functions 1 1
Number of Terminals 54 54
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HSSOP HSSOP
Package Equivalence Code SSOP54,.4 SSOP54,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.65 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.5 mm 7.5 mm
Base Number Matches 3 2
Rohs Code No
ECCN Code EAR99
JESD-609 Code e0
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 220
Terminal Finish TIN LEAD
Time@Peak Reflow Temperature-Max (s) 30

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