MC3361BD
vs
S1T3361D01-D0B0
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP16,.25
|
0.300 INCH, DIP-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
AUDIO SINGLE CHIP RECEIVER
|
AUDIO DEMODULATOR
|
| Demodulation Type |
FM
|
FM
|
| Harmonic Distortion |
0.86%
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
| JESD-609 Code |
e0
|
|
| Length |
9.9 mm
|
19.4 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-30 °C
|
-20 °C
|
| Output Voltage-Nom (FM) |
160 mV
|
150 mV
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP16,.25
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
5.08 mm
|
| Supply Current-Max |
6.4 mA
|
8 mA
|
| Supply Voltage-Max (Vsup) |
8 V
|
7 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2.5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MC3361BD with alternatives
Compare S1T3361D01-D0B0 with alternatives