MC33560ADTBR2
vs
MC33560ADW
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
ON SEMICONDUCTOR
|
Part Package Code |
TSSOP
|
SOIC
|
Package Description |
PLASTIC, TSSOP-24
|
PLASTIC, SO-24
|
Pin Count |
24
|
24
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
JESD-609 Code |
e0
|
e0
|
Length |
7.8 mm
|
15.395 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
240
|
235
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
2.65 mm
|
Supply Voltage-Max (Vsup) |
6.6 V
|
6.6 V
|
Supply Voltage-Min (Vsup) |
1.8 V
|
1.8 V
|
Supply Voltage-Nom (Vsup) |
4 V
|
4 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
5.6 mm
|
7.5 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MC33560ADTBR2 with alternatives
Compare MC33560ADW with alternatives