MC33389ADHR2
vs
MC33389ADHR2
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MOTOROLA INC
|
FREESCALE SEMICONDUCTOR INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
HSOP,
|
HSOP,
|
Pin Count |
20
|
20
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
Length |
15.9 mm
|
15.9 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HSOP
|
HSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
SMALL OUTLINE, HEAT SINK/SLUG
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.4 mm
|
3.4 mm
|
Supply Voltage-Nom |
12 V
|
12 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
11 mm
|
11 mm
|
Base Number Matches |
1
|
1
|
|
|
|