MC33272P
vs
LF412ACN/NOPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
NATIONAL SEMICONDUCTOR CORP
Package Description
PLASTIC, DIP-8
DIP-8
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Architecture
VOLTAGE-FEEDBACK
VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB)
0.65 µA
0.0002 µA
Bias Current-Max (IIB) @25C
0.65 µA
0.0002 µA
Common-mode Reject Ratio-Min
80 dB
80 dB
Common-mode Reject Ratio-Nom
100 dB
100 dB
Frequency Compensation
YES
YES
Input Offset Voltage-Max
1000 µV
1000 µV
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e3
Length
9.78 mm
9.8171 mm
Low-Offset
NO
NO
Neg Supply Voltage Limit-Max
-18 V
-22 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-20 V
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.45 mm
5.08 mm
Slew Rate-Min
8 V/us
10 V/us
Slew Rate-Nom
10 V/us
15 V/us
Supply Current-Max
2.75 mA
5.6 mA
Supply Voltage Limit-Max
18 V
22 V
Supply Voltage-Nom (Vsup)
15 V
20 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Matte Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
24000
4000
Voltage Gain-Min
30000
50000
Width
7.62 mm
7.62 mm
Base Number Matches
3
2
Part Package Code
DIP
Pin Count
8
Input Offset Current-Max (IIO)
0.025 µA
Low-Bias
YES
Moisture Sensitivity Level
1
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Screening Level
MIL-STD-883
Time@Peak Reflow Temperature-Max (s)
40
Compare MC33272P with alternatives
Compare LF412ACN/NOPB with alternatives