MC33272AD
vs
LMV824MTC
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MOTOROLA INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
TSSOP
|
| Package Description |
SOP,
|
TSSOP,
|
| Pin Count |
8
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.8 µA
|
0.14 µA
|
| Common-mode Reject Ratio-Min |
80 dB
|
|
| Common-mode Reject Ratio-Nom |
100 dB
|
85 dB
|
| Input Offset Voltage-Max |
1800 µV
|
4000 µV
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G14
|
| JESD-609 Code |
e0
|
|
| Length |
4.9 mm
|
5 mm
|
| Neg Supply Voltage Limit-Max |
-18 V
|
-2.75 V
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
|
| Number of Functions |
2
|
4
|
| Number of Terminals |
8
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.2 mm
|
| Slew Rate-Min |
8 V/us
|
|
| Slew Rate-Nom |
10 V/us
|
1.5 V/us
|
| Supply Current-Max |
6 mA
|
|
| Supply Voltage Limit-Max |
18 V
|
2.75 V
|
| Supply Voltage-Nom (Vsup) |
15 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
24000
|
5000
|
| Voltage Gain-Min |
19952.6
|
|
| Width |
3.9 mm
|
4.4 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare MC33272AD with alternatives
Compare LMV824MTC with alternatives