MC3301P vs LM2900DG4 feature comparison

MC3301P Motorola Mobility LLC

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LM2900DG4 Texas Instruments

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC TEXAS INSTRUMENTS INC
Part Package Code DIP SOIC
Package Description DIP, SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.3 µA 0.2 µA
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e0 e4
Length 18.86 mm 8.65 mm
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.69 mm 1.75 mm
Slew Rate-Nom 0.5 V/us 0.5 V/us
Supply Current-Max 14 mA 10 mA
Supply Voltage Limit-Max 28 V 36 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 4000 2500
Voltage Gain-Min 1200 1200
Width 7.62 mm 3.9 mm
Base Number Matches 1 1
Pbfree Code Yes
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 0.2 µA
Frequency Compensation YES
Low-Offset NO
Moisture Sensitivity Level 1
Package Equivalence Code SOP14,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

Compare MC3301P with alternatives

Compare LM2900DG4 with alternatives