MC2010P-3162-FT101 vs HQ1007F3162TEE feature comparison

MC2010P-3162-FT101 RCD Components Inc

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HQ1007F3162TEE Royal Electronic Factory (Thailand) Co Ltd

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Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature PRECISION
Construction Chip Chip
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.6 mm 2.5 mm
Packing Method TR TR
Rated Power Dissipation (P) 0.75 W 0.75 W
Resistance 31600 Ω 31600 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Rohs Code Yes
JESD-609 Code e3
Rated Temperature 125 °C
Reference Standard AEC-Q200
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier

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