We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

MC2010P-3013-FB101 vs 201007F3013BC feature comparison

MC2010P-3013-FB101 RCD Components Inc

Buy Now Datasheet

201007F3013BC Royal Electronic Factory (Thailand) Co Ltd

Buy Now Datasheet
Part Life Cycle Code Active Obsolete
Ihs Manufacturer RCD COMPONENTS INC ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Additional Feature PRECISION
Construction Chip Chip
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.6 mm 2.5 mm
Packing Method BULK
Rated Power Dissipation (P) 0.75 W 0.75 W
Resistance 301000 Ω 301000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Series 2010(3/4WS,F TOL)
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

Compare MC2010P-3013-FB101 with alternatives

Compare 201007F3013BC with alternatives