MC2010P-2261-FB101Q vs RMC50K2261FB feature comparison

MC2010P-2261-FB101Q RCD Components Inc

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RMC50K2261FB Kamaya Inc

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Pbfree Code No
Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC KAMAYA ELECTRIC CO LTD
Package Description CHIP CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Additional Feature PRECISION
Construction Chip Rectangular
JESD-609 Code e0
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.6 mm 2.5 mm
Packing Method BULK BULK
Rated Power Dissipation (P) 0.75 W 0.75 W
Resistance 2260 Ω 2260 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Rated Temperature 70 °C
Reference Standard AEC-Q200

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