MC2010P-2102-DT101W
vs
TSR2GD2102V
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
RCD COMPONENTS INC
TATEYAMA KAGAKU GROUP
Package Description
CHIP, ROHS COMPLIANT
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
Additional Feature
PRECISION
Construction
Chip
Chip
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.6 mm
Package Length
5 mm
5 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.6 mm
2.5 mm
Packing Method
TR
Tape
Rated Power Dissipation (P)
0.75 W
0.75 W
Resistance
21000 Ω
21000 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
0.5%
0.5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
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