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MC2010P-2003-FT101Q vs 201007F2003TD feature comparison

MC2010P-2003-FT101Q RCD Components Inc

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201007F2003TD Royal Electronic Factory (Thailand) Co Ltd

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Active Active
Ihs Manufacturer RCD COMPONENTS INC ROYAL ELECTRONIC FTY CO LTD
Package Description CHIP
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30
Additional Feature PRECISION
Construction Chip Chip
JESD-609 Code e0
Mounting Feature SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.6 mm 0.55 mm
Package Length 5 mm 5 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 2.6 mm 2.5 mm
Packing Method TR
Rated Power Dissipation (P) 0.75 W 0.75 W
Resistance 200000 Ω 200000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 2010 2010
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 100 ppm/°C 100 ppm/°C
Terminal Finish Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 1% 1%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Resistors » Metal Glaze/Thick Film Resistors
Resistors » Metal Glaze/Thick Film Resistors

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