MC2010P-1331-DB101Q
vs
NRC-AS50D1331TRF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
RCD COMPONENTS INC
NIC COMPONENTS CORP
Package Description
CHIP
SMT, 2010
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.30
8533.21.00.30
Category CO2 Kg
4.54
4.54
Compliance Temperature Grade
Military: -55C to +155C
Military: -55C to +155C
Candidate List Date
2024-01-23
2024-06-27
SVHC Over MCV
7439-92-1
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.31
CMRT V6.31
Additional Feature
PRECISION
ANTI-SULFUR
Construction
Chip
Rectangular
JESD-609 Code
e0
e3
Mounting Feature
SURFACE MOUNT
SURFACE MOUNT
Number of Terminals
2
2
Operating Temperature-Max
155 °C
155 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.6 mm
0.55 mm
Package Length
5 mm
5 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
2.6 mm
2.5 mm
Packing Method
BULK
TR, Paper, 7 Inch
Rated Power Dissipation (P)
0.75 W
0.75 W
Resistance
1330 Ω
1330 Ω
Resistor Type
FIXED RESISTOR
FIXED RESISTOR
Size Code
2010
2010
Surface Mount
YES
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
100 ppm/°C
100 ppm/°C
Terminal Finish
Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
WRAPAROUND
Tolerance
0.5%
0.5%
Working Voltage
200 V
200 V
Base Number Matches
1
1
Factory Lead Time
16 Weeks
EU RoHS Version
RoHS 2 (2015/863/EU)
EU RoHS Exemptions
7(c)-I
EFUP
15
Rated Temperature
70 °C
Compare MC2010P-1331-DB101Q with alternatives
Compare NRC-AS50D1331TRF with alternatives